Production mode and present situation of power semiconductor
Jan 06, 2022
POWER semiconductor mainly includes POWER diode, Schottky diode, thyristor, POWER bipolar transistor, POWER MOS IGBT (insulated gate transistor).
Production mode:
IDM mode (integration-device-manufacturing) : including design-manufacturing-testing, and even downstream electronic terminal products; In the domestic market, Shilanwei, Huawei and Yangjie are mainly IDM models; Foundry: chip processing, like Shanghai's Huahong and SMIC; Fabless: FABless refers to a company that does not produce chips, but does design them, directly to customers.
Power semiconductor wafer size: mainly including 6, 8 inches, 8 inches with a certain competitiveness, the international market is 8 inches in power devices, a small amount of 6 inches line, the domestic 6 inches relatively more. Infineon has a 12 inch chip, Toshiba, Mitsubishi, Korea, Taiwan enterprises, power semiconductor is mainly 8 inches; 12 inches is difficult, take IGBT as an example, silicon wafer thin to 70-120 micron after the multi-step process, very difficult; There is a comparative advantage is 8 inch processing technology mature.
Application market
Power device applications: automotive (electric vehicle, hybrid electric vehicle) UPS, rail transit, photovoltaic, wind power (inverter conversion), motor drive (DC AC), industrial field (welding machine), medical and large demand consumer (white goods, lighting, camera camera). To Yole published IGBT in each application field accounted for data for example, 2014 and 2020 data comparison, 14 IGBT automotive electronics accounted for 24%, is expected to rise to 46% in 2020, close to 50%; The second largest application is motor, which will account for 15% in 2014 and 12% in 2020. In 2014, the proportion of PHOTOVOLTAIC inverter IGBT is 10%, in 2020, the proportion is 9%; Welding machine 3% in 2014, and maintain around 3% in 2020; IGBT white goods accounted for 5% in 2014, and it is expected to be 3% in 2020. The biggest increase is in electric vehicles and hybrid electric vehicles. IGBT chip manufacturing -- module IPM -- inverter (device) three parts, take the automobile as an example：
(1) The chip end is the main manufacturers of Infineon, IR, Hitachi and Mitsubishi;
(2) IGBT module (electric vehicle drive module), Mitsubishi, NISSAN, Infineon, BOSCH and BYD, etc.
(3) Inverter power supply of new energy vehicles: Mitsubishi's inverter power supply is used in Volt and NISSAN, while Infineon and BOSCH are used in Volkswagen and DAIMLER.
